Industry-estimated monthly CoWoS capacity with TSMC doubling statement
This statistic measures one of the tightest AI-chip bottlenecks in Taiwan’s supply chain. TSMC told investors it was working to double CoWoS capacity in 2025. TrendForce reported an estimated move from roughly 35k to 75k wafers per month. The values are industry estimates, but the direction matches TSMC’s own statement about doubling capacity.
Capacity values are industry estimates and directional company guidance, not final company-disclosed installed capacity.
Use TSMC’s statement that it was working to double CoWoS capacity in 2025 and TrendForce’s 75,000-wafers/month 2025 estimate. The 2024 display is an implied half-base.
TSMC CoWoS Capacity Growth vs Taiwan AI Export Demand
Chip-on-Wafer-on-Substrate (CoWoS) was estimated at 75k wafers/month in 2025.
TSMC Taiwan and Overseas Fab Footprint, 2025
Annual report lists 9 Taiwan fabrication plants (fabs), 5 overseas, and 17 million+ wafers.
TSMC Income Tax Expense Versus Taiwan Tax Revenue, 2025
TSMC’s NT$326.3B tax expense was 28.4% of profit-seeking enterprise income tax.