Chip-on-Wafer-on-Substrate (CoWoS) was estimated at 75k wafers/month in 2025.
AI accelerators depend on advanced packaging as much as wafer fabrication. Chip-on-Wafer-on-Substrate (CoWoS) is one bottleneck that connects TSMC’s technology roadmap to global AI server demand. Pairing the capacity estimate with Taiwan’s information and communications technology (ICT) export surge helps explain why packaging capacity became a strategic infrastructure measure, not a niche manufacturing detail.
Source 1: TSMC Set to Expand CoWoS Capacity to 75,000 Wafers in 2025
Publisher: TrendForce
Dataset/table: CoWoS capacity estimate
Units: wafers per month
Date checked: 2026-05-14
Evidence: TrendForce reports an estimated 75,000 wafers per month in 2025, roughly double 2024 output.
Note: TrendForce reports an estimated 75,000 wafers per month in 2025, roughly double 2024 output.
Source 2: 2025 Annual Report - Business Activities
Publisher: Taiwan Semiconductor Manufacturing Company
Dataset/table: CoWoS technology and AI-demand context
Units: qualitative
Date checked: 2026-05-14
Evidence: TSMC says CoWoS advanced packaging has seen strong growth because of surging AI demand.
Note: TSMC says CoWoS advanced packaging has seen strong growth because of surging AI demand.
Source 3: Annual External Trade Report in 2024
Publisher: Ministry of Finance, R.O.C. (Taiwan)
Dataset/table: 2024 export categories
Units: US$ million; percent
Date checked: 2026-05-14
Evidence: MOF reports 2024 ICT/audio-video export value and growth rate.
Note: MOF reports 2024 ICT/audio-video export value and growth rate.
CoWoS capacity is an industry estimate, not a TSMC audited disclosure. Information-and-communications-technology/audio-video exports are broader than AI accelerators but capture the official export category most exposed to AI servers and related hardware.
Use TrendForce’s Chip-on-Wafer-on-Substrate (CoWoS) wafers-per-month estimate for 2025 and its doubling reference versus 2024. Use Ministry of Finance 2024 information-and-communications-technology/audio-video export value and growth as the export-demand side. TSMC annual-report language supplies the official technology context.
Capacity is from TrendForce while export data is official MOF. The brief is a source-labelled bottleneck-versus-demand graphic, not a same-source statistical series.
TSMC Taiwan and Overseas Fab Footprint, 2025
Annual report lists 9 Taiwan fabrication plants (fabs), 5 overseas, and 17 million+ wafers.
Taiwan’s Largest Wafer-material Suppliers, 2024
Japan dominated Taiwan’s wafer-material import line in the official customs table.
Taiwan’s Largest Memory-chip Import Sources, 2024
Korea supplied nearly half of Taiwan’s listed memory-chip import value.